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Edge compute platforms · FE-1

ForgeEdge — Rugged Edge AI Computer

Compute, field I/O & thermal design in one platform

A scalable edge-computing family combining ForgeEdge-Core processing, an Alvexis carrier, field interfaces and passive cooling in BOX or PCB packages.

Spark / Gate / Prime / Max9–36 V DCBOX / PCB options
Download datasheet ↓Discuss your application
Alvexis ForgeEdge concept hardware
ForgeEdge BOX concept. The datasheet also specifies an open-PCB package for embedded integration.

ForgeEdge-Core → Carrier → ForgeEdge

ForgeEdge-Core · SoM
ForgeEdge-Core · SoM
ForgeEdge · Carrier
ForgeEdge · Carrier
ForgeEdge · PCB + SoM
ForgeEdge · PCB + SoM
ForgeEdge · BOX
ForgeEdge · BOX
Platform overview

Compute, field I/O & thermal design in one platform

ForgeEdge turns a selected compute tier into an integrated system for local AI, sensor fusion, industrial gateways, robotics and machine vision. Spark, Gate, Prime and Max variants let the processor, memory and expansion configuration follow the application.

Match the workload

Choose low-power inference, Linux networking, real-time processing or advanced multi-camera AI without confusing the tiers.

Bring interfaces to the field

Ethernet, CAN / CAN-FD, camera, display, USB and PCIe availability follows the selected variant and carrier.

Integrate power and mechanics

Passive cooling, wide-input DC power and optional DIN-rail or wall-mount adapters support panel and system integration.

Technical overview

System specifications

Selected specifications from the ForgeEdge datasheet. Refer to the document for the full configuration and integration notes.

AreaSpecification
Power input9–36 V DC with reverse-polarity and overcurrent protection
Enclosed dimensions115 × 100 × 50 mm; 300 g as listed in the datasheet
Open PCB105 × 90 mm; approximately 20 mm height; 120–150 g
EnclosurePlastic body with aluminium heatsink cover; IP20
MountingOptional 35 mm DIN-rail / wall adapters; 4 × M3 PCB mounting holes
Operating temperature−40 °C to +80 °C as specified in the datasheet
Humidity5–95% RH, non-condensing
CoolingPassive; power and thermal profile depend on compute tier
Configuration

Select a ForgeEdge compute tier

TierProcessor architectureMemory configuration / peak power
SparkCortex-M55, 800 MHz32 MB PSRAM / 4 W
GateDual Cortex-A7 + Cortex-M4512 MB DDR3L / 8 W
PrimeDual Cortex-A35 + Cortex-M33 + Cortex-M0+2 GB DDR3L or 4 GB DDR4 / LPDDR4 / 15 W
MaxSix Cortex-A55 + Cortex-M7 + Cortex-M3316 GB LPDDR4X / LPDDR5 / 25 W
Applications

Built around your use case

  • Local AI and sensor fusion
  • Robotics and autonomous systems
  • Machine vision and HMI
  • Industrial gateways and mission computing
Integration notes

Configuration matters

Interface counts and AI acceleration are variant-dependent. External accelerators require an appropriate PCIe / M.2 configuration and software support; accelerator ratings are not guaranteed application throughput. IP20 is the enclosed configuration listed in this revision.

Ordering: FE-1-[SPK / GTE / PRM / MAX]-[BOX / PCB].

Product documentation

ForgeEdge datasheet

English · PDF · 8.1 MB · Direct download, no registration

Product options and revision-specific integration notes are included in the document.

Download datasheet ↓
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